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QFN Package Overview
QFN package is probably the most successful package type today. Offering low price, excellent performance and small size, it is an ideal package for many applications. QFN (quad-flat no-leads) is a...
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Semiconductor Assembly and Test Services (SATS) Market and Leaders
Semiconductor Assembly and Test Services are converting rapidly into a pure outsourcing mode of operation. While today perhaps only 50% of the market is using Outsourced Semiconductor Assembly and Test...
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Six ways to improve chip yield rate- before the project starts
Early on in Chip projects, yield is not taken very seriously. The common thinking goes – anyhow there isn’t much to do as this early point of time. However, there are actually several things you can...
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Lead Frame Overview and Custom-Lead Frame Benefits
The name leadframe (or lead-frame) is actually very accurate. Leadframe is an alloy frame that consists of the package leads and the paddle. The silicon die is attached on the paddle and the leads are...
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Is TSMC going to smash IC Packaging Houses?
Two years ago TSMC announced its plans to expand into IC packaging services. It is unclear how much these plans succeeded up till now, but it definitely seems that TSMC is now in an excellent...
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Semiconductor Technology Nodes – History, Trends and Forecast
Semiconductor foundries claim they release a new technology node every two years. They may be off by a year or two, but on the whole, this is quite impressive, no doubt. Come to think of it, I don’t...
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Submitting design files to Assembly house – a Checklist
While assembly houses are gradually becoming more and more organized in regards to following internal processes, it seems that we, their customers, are often trying to push them to make shortcuts only...
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Challenges in Measuring Theta jc for High Thermal Performance Packages
This is a guest post by Jesse Galloway and Ted Okpe of Amkor Technology. Article reprinted from May 2014 Electronics Cooling magazine. One of the more challenging thermal resistance measurements to...
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TSV is a business…Looking for wider adoption!
3D Through Silicon Vias (TSV) is in MEMS, CMOS Image Sensors and high-end applications. When will it be used for mainstream consumer applications?… All results are part of the new report released by...
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Flip Chip Market and Technology Trends
Yole Développement announces its Flip Chip Market and Technology Trends report. Yole Développement’s analysis updates the business status of the Flip-Chip market including data for TIM, underfills,...
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TSV Integration is Creating Growth
“The long term growth of the equipment & materials business will be supported by the expansion of 3D TSV stack platforms” says Yole (Yole Développement) in its latest report, “Equipment &...
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Are Power Planes Necessary for High Speed Signaling?
The performance of a system depends heavily on the communication speed between integrated circuits, which is constrained by the power delivery networks (PDNs). The disruption between the power and...
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Selecting a Wedge Bonder – Tutorial
Palomar/Hughes started designing and manufacturing wedge bonders in the early 1980s for the aerospace and defense industries. Later, these machines were used for a wider array of applications beyond...
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Lidless BGA – Overview
Lidless BGA package essentially offers one main advantage compared to a heatspreader-BGA packages: better thermal performance. The second advantage of the lidless BGA is lower cost due to the fact that...
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WLP Manufacturing Capacities, Growth and Forecast
“The semiconductor industry is facing a new era in which device scaling and cost reduction will not continue on the path they followed for the past few decades, with Moore’s law in its foundation”,...
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Stack Die (3D IC) Assembly – Drivers and Challenges
With the increased demand for improved functionality and miniaturization in portable hand-held devices—such as cell phones, PDA, digital cameras and laptop computers—original equipment manufacturers...
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2.5/3.0D packaging: Path Finding
“We’re only qualified to 40 degrees …‘what business does anyone even have thinking about 18 degrees, we’re in no man’s land’” analyses from Bob Ebeling Thiokol This quote was a very costly...
View ArticleComparing Au, Pt, Ag and Cu Wire Bonding
With the creeping rise in the price of gold, many microelectronics manufacturing companies have been looking for alternatives to reduce the cost of ball bonding. Recently, the trend has been to look...
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ASE purchase 5% of rival SPIL
Mergers and acquisitions happen very frequently in the semiconductor industry. However, what it is not common that these kind of operations proceed smoothly, quickly and without hurdles. This is the...
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STATS ChipPAC Sold to China’s JCET
According to the latest reports, Temasek and China’s Jiangsu Changjiang Electronics Technology Co Ltd (JCET) just signed a $1.8 million deal that will allow JCET to acquire STATS ChipPAC from Temasek....
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