Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source...
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its advanced packaging coordinated platform for the vertical disintegration of chiplets....
View ArticleAmkor Technology Signaling Strong Growth in Vietnam’s Semiconductor Industry
Bac Ninh, Vietnam – September 13, 2023 – Amkor Technology, a leading global provider of semiconductor packaging and test services, has announced significant progress in its operations at its new...
View ArticleFoxconn and HCL JV Secures Land for Semiconductor Plant in Uttar Pradesh, India
[Sep 13, 2024] – Foxconn, a leading global electronics manufacturer, and HCL Technologies, a leading Indian technology services company, have taken a significant step towards establishing a...
View ArticleSkyWater Names Bassel Haddad as Sr. Vice President and General Manager of...
BLOOMINGTON, Minn. – September, 2024 – SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced the appointment of Bassel Haddad as senior vice president and...
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Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in...
TEMPE, Ariz. & HSINCHU, Taiwan–(BUSINESS WIRE)–Oct. 3, 2024– Amkor Technology, Inc. (Nasdaq: AMKR) and TSMC (TWSE: 2330, NYSE: TSM) announced today that the two companies have signed a memorandum...
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The Ultimate Guide to QFP Package
Introduction In semiconductor technology, packaging with compact size and high performance is in high demand. Among several discovered semiconductor packaging technologies, Quad Flat Pack (QFP) has...
View ArticleFaraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, and Kiwimoore, a global leader in AI networking full-stack interconnect products and solutions, announced...
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2.5D Packaging: Ultimate Guide
Imagine a world where electronic devices are exponentially more powerful yet astonishingly compact. This is the promise of 2.5D packaging, an innovative approach to semiconductor design. It’s reshaping...
View ArticleAmkor Technology Reports Strong Q3 2024 Results, Driven by Advanced SiP Demand
Oct. 28, 2024– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced robust financial results for the third quarter ended September 30,...
View ArticleUMC Secures Major Advanced Packaging Order from Qualcomm, Challenging TSMC’s...
Dec-16-2024 — United Microelectronics Corporation (UMC) (TW:2303) today announced a significant breakthrough in the advanced packaging market, securing a major contract from Qualcomm Incorporated...
View ArticleOSAT Location
Outsourced Semiconductor Assembly and Test, commonly referred to as OSAT, plays a vital role in the semiconductor industry. These companies specialize in assembling and testing semiconductor devices...
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Introduction to Chip Scale Packaging
Chip Scale Packaging (CSP) emerges as a groundbreaking solution that optimizes space while enhancing performance in the realm of microelectronics. This innovative packaging method is transforming how...
View ArticleMicross Acquires Integra Technologies, Creating the Leading U.S. Domiciled...
MELVILLE, N.Y., Jan. 15, 2025 /PRNewswire/ — Micross Components, Inc. (“Micross” or the “Company”), a leading provider of high-reliability microelectronic product and service solutions for aerospace,...
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Understanding Heterogeneous Integration (HI)
Heterogeneous integration offers a solution by allowing different materials and components to work together seamlessly, driving innovation in various applications. This approach not only enhances...
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Understanding Multi Chip Module (MCM)
Multi Chip Modules (MCM) have emerged as a game-changing solution. As consumer demand for faster, more powerful electronics increases, traditional chip designs can no longer meet the growing need for...
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The Global Expansion of Advanced Semiconductor Packaging Facilities: A 2025...
The semiconductor industry is experiencing a surge in investment and expansion of advanced packaging facilities, driven by increasing demand for high-performance computing and other applications....
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