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Introduction to Chip Scale Packaging
Chip Scale Packaging (CSP) emerges as a groundbreaking solution that optimizes space while enhancing performance in the realm of microelectronics. This innovative packaging method is transforming how...
View ArticleMicross Acquires Integra Technologies, Creating the Leading U.S. Domiciled...
MELVILLE, N.Y., Jan. 15, 2025 /PRNewswire/ — Micross Components, Inc. (“Micross” or the “Company”), a leading provider of high-reliability microelectronic product and service solutions for aerospace,...
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Understanding Heterogeneous Integration (HI)
Heterogeneous integration offers a solution by allowing different materials and components to work together seamlessly, driving innovation in various applications. This approach not only enhances...
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Understanding Multi Chip Module (MCM)
Multi Chip Modules (MCM) have emerged as a game-changing solution. As consumer demand for faster, more powerful electronics increases, traditional chip designs can no longer meet the growing need for...
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The Global Expansion of Advanced Semiconductor Packaging Facilities: A 2025...
The semiconductor industry is experiencing a surge in investment and expansion of advanced packaging facilities, driven by increasing demand for high-performance computing and other applications....
View ArticleASE Expands its Chip Packaging and Testing Facility to Enable Next-Gen...
BAYAN LEPAS, Malaysia, February 18, 2025–ASE has officially launched its fifth plant in Penang, which will significantly build on the company’s strong packaging and testing capabilities in the Bayan...
View ArticleSarcina Technology launches AI platform To enable cost-effective customizable...
Palo Alto, CA – 25 March 2025. Sarcina Technology, a global semiconductor packaging specialist, is excited to announce the launch of its innovative AI platform to enable advanced AI packaging solutions...
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The Ultimate Guide to DFN Package
The DFN (Dual Flat No-leads) and its counterpart, the QFN (Quad Flat No-leads), are increasingly prevalent in high-performance applications. They’re favored for applications ranging from consumer...
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Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth,...
May 13, 2025 —- TrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological...
View ArticleFoxconn Invests €250M in Europe’s First Fan-Out Wafer Level Packaging Plant
Paris, France – May 19, 2025 – Foxconn Technology Group today unveiled a comprehensive €250 million investment plan in Europe, marking a strategic expansion into advanced semiconductor packaging,...
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