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2.5D Packaging: Ultimate Guide

Imagine a world where electronic devices are exponentially more powerful yet astonishingly compact. This is the promise of 2.5D packaging, an innovative approach to semiconductor design. It’s reshaping...

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Amkor Technology Reports Strong Q3 2024 Results, Driven by Advanced SiP Demand

Oct. 28, 2024– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced robust financial results for the third quarter ended September 30,...

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UMC Secures Major Advanced Packaging Order from Qualcomm, Challenging TSMC’s...

Dec-16-2024 — United Microelectronics Corporation (UMC) (TW:2303) today announced a significant breakthrough in the advanced packaging market, securing a major contract from Qualcomm Incorporated...

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OSAT Location

Outsourced Semiconductor Assembly and Test, commonly referred to as OSAT, plays a vital role in the semiconductor industry. These companies specialize in assembling and testing semiconductor devices...

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Introduction to Chip Scale Packaging

Chip Scale Packaging (CSP) emerges as a groundbreaking solution that optimizes space while enhancing performance in the realm of microelectronics. This innovative packaging method is transforming how...

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Micross Acquires Integra Technologies, Creating the Leading U.S. Domiciled...

MELVILLE, N.Y., Jan. 15, 2025 /PRNewswire/ — Micross Components, Inc. (“Micross” or the “Company”), a leading provider of high-reliability microelectronic product and service solutions for aerospace,...

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Understanding Heterogeneous Integration (HI)

Heterogeneous integration offers a solution by allowing different materials and components to work together seamlessly, driving innovation in various applications. This approach not only enhances...

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Understanding Multi Chip Module (MCM)

Multi Chip Modules (MCM) have emerged as a game-changing solution. As consumer demand for faster, more powerful electronics increases, traditional chip designs can no longer meet the growing need for...

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The Global Expansion of Advanced Semiconductor Packaging Facilities: A 2025...

The semiconductor industry is experiencing a surge in investment and expansion of advanced packaging facilities, driven by increasing demand for high-performance computing and other applications....

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ASE Expands its Chip Packaging and Testing Facility to Enable Next-Gen...

BAYAN LEPAS, Malaysia, February 18, 2025–ASE has officially launched its fifth plant in Penang, which will significantly build on the company’s strong packaging and testing capabilities in the Bayan...

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