Clik here to view.
Amkor Opens New Semiconductor Package Manufacturing and Test Plant in Taiwan
Amkor Technology announced on September 10th the opening of its new manufacturing and test plant at Longtan Science Park in Taiwan. “Demand for Amkor’s advanced assembly and test services in Taiwan...
View ArticleClik here to view.
JCET Group Appoints Distinguished Semiconductor Industry Executive Dr. Lee...
STATS ChipPAC Pte. Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and test services, announced Friday that the Board of Directors of its holding...
View ArticleClik here to view.
Advanced Packaging Technologies are key for Semiconductor Innovation
“2017 was an unprecedented year for semiconductor industry”, comments Santosh Kumar, Director of Packaging, Assembly and Substrates at Yole Korea, part of Yole Développement (Yole). “The market grow by...
View ArticleClik here to view.
WLCSP Overview, Market and Applications
Since the development of the first ASIC, the IC package was a mean to protect the silicon die and to provide means to PCB connectivity. Back then, the IC package was large and introduced various...
View ArticleClik here to view.
Amkor Introduces TOLL & PSMC Packages for Automotive Applications
The TOLL package is a highly efficient space-saving package featuring extremely low Rds(on) and strong thermal performance making it well suited for high current and high voltage applications. It meets...
View ArticleClik here to view.
IC Packaging: consumer solutions are adapted for automotive applications
“Automotive is the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole). The market is showing significant market drivers...
View ArticleBeckermus Technologies Announces Partnership with Engage Photonics
Beckermus Technologies was founded in 1998 and serves as an Excellence Center in the field of “Bare Die” assembly services for micro-electronic and micro-optical systems. Beckermus Technologies has...
View ArticleClik here to view.
Amkor Offers Optical Package Solutions for Multiple Applications
Amkor Technology, a leading provider of outsourced semiconductor assembly and test (OSAT) services, today announced the extension of its MEMS and Sensor package platforms to address the growing optical...
View ArticleClik here to view.
An Introduction to BGA Package
With the levels of integration rising to unprecedented levels and the requirement of integrated circuits with a high number gate and pins increased day by day, there was a need to manufacture a package...
View ArticleClik here to view.
Fan-Out is becoming imperative to stay competitive within the advanced...
“Fan-Out Packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and part of the Semiconductor & Software team at Yole Développement...
View ArticleClik here to view.
CEO Talk: Oliver Maiwald, Sencio B.V
This interview was held with Mr. Oliver Maiwald, CEO of Sencio B.V. Tell me a bit about your background? How did you first get started with Sencio? I have had a fairly circuitous route to the role...
View ArticleClik here to view.
Short Guide to Selecting IC Package
Semiconductor integrated circuits (ICs) are an essential component of every other modern technology which is why they have undergone some of the most extensive growth. Today, IC packaging offering is...
View ArticleClik here to view.
TOP 25 OSATs Ranking 2018
The leading giant of the OSATs, ASE Technology Holding Co., Ltd. (formerly ASE Inc.) and subsidiaries, has just got even bigger after the official acquisition of SPIL on April 30 2018. In 2018e, ASE...
View ArticleClik here to view.
CEO Talk: Oren Beckermus, CEO of Beckermus
This interview was help with Mr. Oren Beckermus, which is Co-CEO of Beckermus. Tell me about Beckermus Technologies? Beckermus Technology is a privately-owned company, I co-own it with my...
View ArticleClik here to view.
Is Fan-Out packaging still popular?
Extracted from: Equipment and Materials for Fan-Out Packaging report and Fan-Out Packaging: Technologies & Market Trends, Yole Développement, 2019 “Although the inflated excitement has started to...
View ArticleClik here to view.
The Ultimate Guide to Lead Frame
Lead Frame Overview A lead frame is a generic term for a type of (mostly) low-cost IC package assembly used for DIL types packages as well as PLCCs and QFNs. The frame is typically made of a thin...
View ArticleClik here to view.
Vehicle autonomy & electrification are pushing the adoption of advanced...
“Advanced packaging solutions will double their market shares within the automotive industry in the coming 5 years, reaching US$550 million” announces Mario Ibrahim, Technology & Market Analyst at...
View ArticleClik here to view.
System-in-Package (SiP), a success story
“The demand for SiP[1] has increased significantly in recent years, with an adoption in a wide ranging of applications”, announces Favier Shoo, Technology & Market Analyst at Yole Développement...
View ArticleClik here to view.
Wafer Level Packaging Market Information 2020
WLP will definitely be a winner by 2025, declared Yole Développement (Yole) in its new Advanced Packaging Quarterly Market Monitor. $2.5B will be the market figure to remember as it will be Fan-out...
View ArticleClik here to view.
Fan-Out packaging: what will be the next killer application?
“Fan-out packaging continues to evolve, establishing a new market class, UHD Fan-Out,” asserts Favier Shoo, Technology & Market Analyst at Yole Développement (Yole). “Being actively explored and...
View Article