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Understanding IC Package Thermal Characteristics
One of the most common factors that can have a lasting impact on any given semiconductor device is heat. Any logic circuit or electronic device requires a power supply to drive the function of its...
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48V Ecosystem and Power IC Packaging Trends
With each passing year, emerging growth application areas such as Automotive, Cloud Computing, Industrial Automation and Telecom (5G) Infrastructure are garnering more attention. Although the...
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ficonTEC and PHIX partner to enable high-volume manufacturing of multi-chip...
PHIX B.V. of Enschede, The Netherlands, is a Dutch packaging foundry that assembles their customers’ photonic integrated circuits into complete modules. As these modules evolve from initial prototypes...
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Unit-Level Traceability for Automotive Customers
Automotive product traceability has existed in one form or another for several decades. Traceability generally refers to tracking and tracing each component that comprises every sub-system in a car....
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Webinar – High End Electronics meets Optics
AEMtec GmbH located in Berlin Germany provides a new 2021 Eight Session Webinar Series “Next Level of Technology – High End Electronics meets Optics”. Launch of webinar series in February. New industry...
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Amkor Factory Intelligence Enables Industry 4.0
TEMPE, Ariz., February 23, 2021 ― Amkor Technology, Inc. (Nasdaq: AMKR), a leader in advanced packaging technologies that support high-growth markets, including smartphones and 5G, advanced automotive...
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Qmode project with QuiX
The Qmode project is funded with an MIT-R&D collaboration project grant from the Provincie Overijssel, dedicated to stimulate the innovation and development of products, processes and services of...
View ArticleAEMTec Joins AnySilicon’s Marketing Platform
AnySilicon, the leading marketplace for semiconductor service providers, announced today that AEMTec, a leading packaging and assembly services provider, has joined AnySilicon to promote its services....
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OSAT – Outsourced Semiconductor Assembly and Test
Figure 1 – OSAT Offering by Application and by Types of Packaging What is OSAT? OSAT stands for Outsourced Semiconductor Assembly and Test. This is a third-party service that suppliers around the...
View ArticlePresto Engineering and Cadence Collaborate on IC Packaging for Automotive and...
Meyreuil, France and San Jose, Calif., June 24, 2021—Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a...
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Will an Adhesion Promoter Prevent Delamination in Power Semiconductor Packages?
Power semiconductor packages are used in high temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid electric vehicles (HEV) in the automotive market, demands...
View ArticleCaliber Interconnect Solutions Joins AnySilicon Program
AnySilicon, the leading marketplace for semiconductor service providers, announced today that Caliber Interconnect Solutions, a product engineering solutions company, has joined AnySilicon to promote...
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AEMtec GmbH announces USA Tech Center Opening in Boston, MA.
Boston, MA – AEMtec GmbH from Berlin, Germany, a company widely known for its high precision microelectronic and Silicon Photonic assembly capabilities, announced today the September 1st opening of its...
View ArticleQP Technologies Partners with AnySilicon
AnySilicon, the leading marketplace for semiconductor service providers, announced today that QP Technologies, a worldwide leader in packaging and assembly services, has partnered with AnySilicon to...
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CEO Talk: Sureshbabu K of Caliber Interconnect Solutions
It has been our pleasure to interview Sureshbabu K, MD of Caliber Interconnect Solutions. In this engaging conversation, he shares Caliber’s journey so far and what lies ahead for his company as it has...
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Sondrel reduces lead times in SOC development via an early assignment of...
Because Sondrel offers a full turnkey service of ASIC production from design through to shipping silicon, it knows what is happening with services at every stage of the manufacturing and test process....
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Wire Bonding for High-Reliability RF Device Applications
First introduced by Bell Labs in 1957, wire bonding is an integrated circuit (IC) manufacturing method used in more than 40 billion microelectronic devices each year. Wire bonding is used extensively...
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Understanding Wafer Level Packaging
Wafer Level Packaging or WLP, is a type of IC packaging technology that is performed at wafer level. This means that the packaging is applied on whole wafers and wafers are diced only after the...
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Introduction to System in Package (SiP)
System in Package (SiP) is a method used for bundling multiple integrated circuits (ICs) and passive components into a single package, under which they all work together. This contrasts to a System on...
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Automotive Chip Shortages – An Assembly Perspective
Since March 2020, the pandemic has brought on scarcity in odd goods like toilet paper, baking flour and exercise equipment. The latest casualty is the auto industry as car production across the world...
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